Product Overview & Key Features
ZYPEEK® 550G is an injection-molding grade polyetheretherketone (PEEK) resin produced by Jilin Zhongyan Polymer Co., Ltd. The material appears as light amber translucent pellets and belongs to high-crystallinity, medium-melt-index aromatic thermoplastic specialty engineering plastics, with a melt mass-flow rate (380 °C, 5 kg) of 20 g/10 min. 550G possesses a typical comprehensive performance combination characteristic of PEEK materials: its continuous use temperature can reach up to 250 °C, and it maintains a volume resistivity of 1.0E+9 ohms·cm even at high temperatures of 275 °C; simultaneously, it combines high rigidity (flexural modulus of 4200 MPa) with exceptional chemical corrosion resistance. This grade is specifically designed for precision injection molding processes, making it suitable for industrial components that demand stringent dimensional stability, wear resistance, and electrical insulation performance.
Technical Specifications
Physical Properties
| Property | Test Value | Test Unit | Test Standard |
| Density (Crystalline) | 1.3 | g/cm³ | ISO 1183 |
| Density (Amorphous) | 1.26 | g/cm³ | ISO 1183 |
| Shore Hardness D (23 °C) | 85 | — | ISO 868 |
| Water Absorption, Saturated (23 °C, 3.2 mm, Immersed) | 0.07 | % | ISO 62-1 |
| Water Absorption, Equilibrium (23 °C, 3.2 mm, Immersed) | 0.4 | % | ISO 62-1 |
| Mold Shrinkage, Parallel | 1 | % | ISO 294-4 |
| Mold Shrinkage, Normal | 1.3 | % | ISO 294-4 |
| Melt Mass-Flow Rate (380 °C, 5 kg) | 20 | g/10 min | ISO 1133 |
Mechanical Properties
| Property | Test Value | Test Unit | Test Standard |
| Tensile Strength, Break (23 °C) | 100 | MPa | ISO 527 |
| Tensile Strain, Yield (23 °C) | 40 | % | ISO 527 |
| Flexural Strength (23 °C) | 170 | MPa | ISO 178 |
| Flexural Modulus (23 °C) | 4200 | MPa | ISO 178 |
| Compressive Strength (23 °C) | 125 | MPa | ISO 604 |
| Charpy Impact Strength, Notched | 6 | kJ/m² | ISO 179 |
| Izod Impact Strength, Notched | 6.5 | kJ/m² | ISO 180 |
Thermal Properties
| Property | Test Value | Test Unit | Test Standard |
| Melting Point | 343 | °C | ISO 11357 |
| Glass Transition Temperature (Tg) | 143 | °C | ISO 11357 |
| Specific Heat Capacity (23 °C) | 2.2 | kJ/(kg·°C) | DSC |
| Coefficient of Linear Thermal Expansion (CTE), Parallel (<Tg, Flow Direction) | 45 | ppm/K | ISO 11359 |
| Coefficient of Linear Thermal Expansion (CTE), Normal (>Tg, Flow Direction) | 120 | ppm/K | ISO 11359 |
| Deflection Temperature Under Load (1.8 MPa) | 152 | °C | ISO 75 |
| Thermal Conductivity (23 °C) | 0.29 | W/(m·K) | ISO 22007-4 |
Electrical Properties
| Property | Test Value | Test Unit | Test Standard |
| Dielectric Strength (2 mm) | 23 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index (CTI) | 150 | V | IEC 60112 |
| Dielectric Constant (23 °C, 1.0e+3 Hz) | 3.2 | — | IEC 60250 |
| Dielectric Constant (23 °C, 50 Hz) | 4.5 | — | IEC 60250 |
| Dissipation Factor (23 °C, 1.0e+6 Hz) | 0.003 | — | IEC 60250 |
| Volume Resistivity (23 °C, 1 V) | 1.00E+16 | Ω·cm | IEC 60093 |
| Volume Resistivity (275 °C) | 1.00E+09 | Ω·cm | IEC 60093 |
Disclaimer: The technical specifications for Jilin Zhongyan Polymer ZYPEEK® 550G presented herein are derived from data issued by Jilin Zhongyan Polymer Co., Ltd. or certified third-party testing institutions. While we have made every effort to ensure the accuracy of the information provided, we assume no liability for any consequences arising from the use of ZYPEEK® 550G based on these data. Given the variables involved in processing conditions, we strongly recommend conducting thorough trials of ZYPEEK® 550G under your specific operational environment prior to final material selection.
Applications & Processing Guidelines
Typical Applications
The high heat resistance, chemical resistance, and electrical insulation properties of ZYPEEK® 550G make it suitable for high-value-added industrial sectors:
- Aerospace & Automotive: Non-load-bearing parts around engines, bearing cages, seal rings, precision fuel system valves, and sensor housings.
- Electronics & Information Manufacturing: 5G base station high-frequency connectors, wafer carriers (Cassettes), semiconductor packaging mold components, and high-temperature cable insulation layers.
- Industrial Wear-Resistant Parts: Compressor valve plates, gears, pump casings, piston rings, and oil-free lubricated bearings, leveraging its low friction coefficient and high PV limit.
- Medical Precision Instruments: Surgical instrument handles capable of repeated high-temperature steam sterilization, endoscope structural components, and dental equipment parts (subject to verification of specific biocompatibility certifications).
Processing Guidelines
- Drying Pretreatment: Although PEEK has low moisture absorption (saturated water absorption of 0.07%), it must be thoroughly dried prior to high-temperature processing to prevent hydrolytic degradation. Drying in a hot-air circulating oven at 150 °C for 3 to 4 hours is recommended to ensure a moisture content below 0.02%.
- Injection Molding Process: Melt temperature is recommended to be controlled between 370 to 400 °C. Due to the MFR of 20 g/10 min for ZYPEEK® 550G, it exhibits favorable fluidity and can fill thin-walled complex structures. Mold temperature must be maintained at 160 to 200 °C to promote crystallization and prevent internal stress concentration or insufficient crystallinity caused by rapid cooling. The screw length-to-diameter ratio (L/D) of the injection molding machine is recommended to be greater than 18:1, with a compression ratio between 2.0 and 3.0.
- Post-Processing (Annealing): To enhance product crystallinity and dimensional stability, annealing treatment at 200 to 250 °C is recommended (duration depending on wall thickness), followed by slow cooling. This helps relieve internal stresses and further elevates heat deflection temperature and chemical resistance.
Logistics, Packaging & Compliance
- Packaging Specifications: Standard packaging consists of 25 kg multi-layer aluminum-plastic composite bags or moisture-proof cartons, lined with anti-static polyethylene bags to ensure the material remains dry and clean during transport and storage. Double-layer vacuum packaging can also be provided upon request for high cleanliness requirements (such as in the semiconductor industry).
- Supply Attribute: ZYPEEK® 550G is classified as a non-hazardous chemical (Non-DG), complying with standard engineering plastic transportation regulations. Air, ocean, and land freight are supported, suitable for global FCL/LCL consolidation operations.
- Delivery Lead Time: Backed by the global supply network and regional inventory layout of TaiKuo New Materials, standard orders can achieve rapid response. Specific delivery schedules depend on Incoterms and destination port customs clearance efficiency. For orders requiring custom baking or specialized testing, lead times will be extended accordingly.
- Compliance & Document Support: Each batch of products is accompanied by complete quality management documents, including Technical Data Sheets (TDS), Material Safety Data Sheets (MSDS/SDS), and Certificates of Analysis (COA). The product complies with RoHS directive and REACH regulation restrictions on hazardous substances. For semiconductor or medical applications, ICP-MS test reports for specific elements can be provided.
- ESG & Environmental Statement: As a high-performance thermoplastic material, PEEK features an extremely long service life and recycling potential. We support circular economy practices and encourage customers to sort and recycle processing regrind (subject to strict process parameter control during reuse). Simultaneously, we are committed to driving green manufacturing of specialty engineering plastics and reducing carbon emissions during production.
5. Frequently Asked Questions (FAQs)
Q1: ZYPEEK® 550G exhibits anisotropic mold shrinkage (parallel 1% vs. normal 1.3%). How should this be addressed during mold design?
A1: PEEK is a semi-crystalline polymer, and molecular orientation along the flow direction leads to lower shrinkage compared to the transverse/normal direction. When designing molds, shrinkage discrepancies must be estimated based on runner layouts, particularly for products with high-precision tolerance requirements (such as positioning pin holes in wafer carriers). Mold flow analysis software such as Moldflow is recommended to simulate filling and packing processes, and trial molding stages should reserve allowances for mold modification. Employing high mold temperatures above 160 °C helps minimize shrinkage variance.
Q2: What does it signify that this material maintains a volume resistivity of 1.0E+9 Ω·cm even at high temperatures of 275 °C?
A2: This indicates that ZYPEEK® 550G possesses exceptional high-temperature electrical insulation performance. The volume resistivity of most organic polymers decreases exponentially with rising temperature, whereas this grade maintains effective insulation even in environments approaching twice its glass-transition temperature (Tg 143 °C). This property makes it exceptionally suitable for electrical insulation components in logging-while-drilling (LWD) equipment, aero-engine sensors, and high-temperature industrial furnaces.
Q3: When selecting materials, what factors should be considered when comparing ZYPEEK® 550G with other specialty engineering plastics such as PPS or PI?
A3: Compared to PPS, PEEK offers higher toughness, better impact resistance, and superior radiation resistance, though at a relatively higher cost; compared to PI (polyimide), PEEK exhibits superior processability (PI typically requires sintering) and better hydrolysis resistance. If the application environment involves high-temperature/high-pressure steam, alternating strong acids and alkalis, or high-load wear, PEEK is generally the preferred choice; if short-term high-temperature resistance is required with a limited budget, PPS can serve as an alternative option.
Q4: How can samples of ZYPEEK® 550G be requested for feasibility verification?
A4: TaiKuo New Materials can supply commercial trial samples for downstream processing enterprises, with sample material costs and freight charges borne by the customer. Customers are advised to utilize samples for complete process validation and performance testing prior to formal production to ensure matching precision between the material and mold design.
